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Qualcomm S3 Third-Generation Audio Platform Equipped with Qualcomm's new generation S3 platform launched in 2024, it delivers an excellent sound quality experience with ultra-low distortion and ultra-high signal-to-noise ratio. This powerful audio platform supports high-resolution audio transmission and advanced noise reduction technology, providing unparalleled clarity and detail, whether in music playback or voice calls.
Hi-Res and Snapdragon Sound Hi-Res certified, the SOUNDPEATS Air5 supports sampling frequencies up to 96 kHz or 192 kHz and 24-bit depth, delivering a wider dynamic range and delicate frequency response. Qualcomm's Snapdragon Sound technology uses higher bit rates (up to 576 kbps) and ultra-low latency (as low as 32 ms) to ensure pure and stable sound quality in wireless transmission.
Bluetooth 5.4, QCC3091 Chip Equipped with the advanced QCC3091 Bluetooth 5.4 chip, the dual upgrade provides a top-notch audio and connectivity experience. Complex environments or long-distance connections remain stable and smooth, while power consumption is further reduced, extending the life of the earphones.
13mm Composite Bio-Diaphragm Speaker The diaphragm is made of a composite of three high-performance materials, combining their advantages to synergistically produce rich bass, warm vocals, and pure treble. With the high-quality 13mm diameter dynamic coil, the sound performance is rich and complete, whether it's the delicate strings of classical music or the fierce rhythm of rock music, it can be perfectly presented.
Intelligent Adaptive AI Noise Reduction Apply the intelligent adaptive AI noise reduction system to detect the usage status in real-time, calculate the noise reduction parameters that match the current environment, and protect against noise more deeply. By adding a windproof woven steel mesh structure, an L-shaped cavity design that weakens wind flow, and a new AI wind noise reduction algorithm, wind noise can be eliminated by up to 90%.